8 Layer Rigid-flex Assembly by Leadsintec
Name: 8 Layer Rigid-flex Assembly by Leadsintec
Origin: china
Certified: UL, CE, RoHS
layers: 1-40 layers
Surface finish: ENIG/HASL/immersion Tin/ immersion Silver/ Hard Gold
Material: Shengyi/ Panasonic/ Durpont/TEQ/TAIFlex
Solder mask :green,blue, white, red, etc
7 Layer Rigid-flex PCB Assembly by Leadsintec
Name: 7 Layer Rigid-flex PCB Assembly by Leadsintec
Origin: china
Certified: UL, CE, RoHS
Surface finish: ENIG/HASL/immersion Tin/ immersion Silver/ Hard Gold
Material: Shengyi/ Panasonic/ Durpont/TEQ/TAIFlex
Solder mask :green, blue, white, red, etc
Board thickness: customized
6 Layer Rigid-flex Assembly by Leadsintec
Name: 6 Layer Rigid-flex Assembly by Leadsintec
Origin: china
Certified: UL, CE, RoHS
Board thickness: customized
Surface finish: ENIG/HASL/immersion Tin/ immersion Silver/ Hard Gold
Material: Shengyi/ Panasonic/ Durpont/TEQ/TAIFlex
Solder mask :green,blue, white, red, etc
Multi-Layerd Rigid-flex PCB Assembly -Leadsintec
Name: Multi-Layerd Rigid-flex PCB Assembly -Leadsintec
Origin: China
Certified: UL, CE, RoHS
Layer Count: 1 – 30 Layers
Surface Treatment: ENIG, Flash Gold, Hard Gold Finger, Gold Plating(50mil), Gold Finger, Selected Gold Plating, ENEPIG, ENIPIG
Board thickness: customized
Soldermask color: typically white, for aesthetic purposes
Surface finish: HASL/ lead-free HASL
Rigid-flex PCB Assembly Electronic Mother Board
Name: Rigid-flex PCB Assembly Electronic Mother Board
Origin: China
Certified: UL, CE, RoHS
Layer count: 1-18 layers
Material: fr4,Tg=135,150,170,180,210,cem-3,cem-1,al base,rogers,nelco
Board thickness: customized
Soldermask color: typically white, for aesthetic purposes
Surface finish: HASL/ lead-free HASL
OEM Rigid-flex PCB Assembly Manufacturer
Name: OEM Rigid-flex PCB Assembly Manufacturer
Origin: China
Certified: UL, CE, RoHS
Base Material: FR4+PI
Board thickness: customized
Soldermask color: typically white, for aesthetic purposes
Surface finish: HASL/ lead-free HASL
Application: Electronics Devices
- PCB Assembly Capability
- PCB Assembly Equipment
The Rigid-Flex PCB Assembly is a cutting-edge solution that combines the benefits of rigid and flexible printed circuit boards (PCBs) into a single, versatile design. With our advanced assembly capabilities, we can bring your complex and space-constrained electronic designs to reality with utmost precision.
Our skilled technicians excel at handling the intricacies of Rigid-Flex PCB Assembly, seamlessly integrating rigid and flexible sections to create a durable and reliable circuit board. Whether you require a multi-layered design or a custom-shaped PCB, we have the expertise to meet your specific requirements.
Advantages of Rigid-Flex PCB Assembly:
- Space optimization: Rigid-Flex PCBs allow you to maximize space utilization within your electronic devices. By eliminating the need for bulky connectors and cables, you can achieve compact designs, enabling sleeker and more portable products.
- Enhanced reliability: Rigid-Flex PCBs are highly resistant to mechanical stress, vibrations, and thermal fluctuations, making them ideal for applications where durability is crucial. The integrated flexible sections offer improved flexibility, reducing the risk of solder joint fatigue and enhancing the board’s overall reliability.
- Design versatility: Rigid-Flex PCBs offer unmatched design flexibility. They can be shaped and bent to fit into non-planar surfaces, enabling innovative and unconventional product designs. This versatility opens up new possibilities for engineers and designers seeking to push the boundaries of product development.
- Simplified assembly: With Rigid-Flex PCB Assembly, the need for interconnecting cables and connectors is significantly reduced, simplifying the assembly process. This leads to faster production cycles and lowers the chances of errors, ensuring efficient and streamlined manufacturing.
- Cost-effectiveness: Despite their advanced capabilities, Rigid-Flex PCBs can often reduce overall manufacturing costs. By eliminating additional components and simplifying assembly, you can save on materials, labor, and assembly time, resulting in a cost-effective solution.
| SMT capacity: 19 million points/day | ||
| Testing Equipment | X-RAY Nondestructive Tester, First Piece Tester, AOI Automatic Optical Tester, ICT Tester, BGA Rework Station | |
| Placement speed | Chip placement speed (at best conditions) 0.036 S/piece | |
| Mounted Component Specifications | Pasteable smallest package | |
| Minimum device accuracy | ||
| IC type chip accuracy | ||
| Mounted PCB Specifications | Substrate size | |
| Substrate thickness | ||
| throw rate | 1. Resistance-capacitance ratio 0.3% | |
| 2. IC type without throwing material | ||
| Board Type | POP/common board/FPC/rigid-flex board/metal substrate | |
| DIP daily production capacity | ||
| DIP plug-in production line | 50000 points/day | |
| DIP post welding production line | 20000 points/day | |
| DIP test production line | 50000pcs PCBA/day | |
| Assembly processing capability | ||
| The company has more than 10 advanced assembly production lines, dust-free and anti-static air-conditioning workshop, TP dust-free workshop, equipped with aging room, test room, functional test isolation room, advanced and perfect equipment, can carry out various product assembly, packaging, testing, Aging, etc. production. Monthly production capacity can reach 150,000 to 300,000 sets/month | ||
| PCBA processing capability | ||
| project | Mass processing capability | Small batch processing capability |
| Number of layers (max) | 2-18 | 20-30 |
| Plate type | FR-4, Ceramic Sheet, Aluminum Base Sheet PTFE, Halogen Free Sheet, High Tg Sheet | PTFE, PPO, PPE |
| Rogers,etc Teflon | E-65, ect | |
| Sheet mixing | 4 layers – 6 layers | 6th floor – 8th floor |
| biggest size | 610mm X 1100mm | / |
| Dimensional Accuracy | ±0.13mm | ±0.10mm |
| Plate thickness range | 0.2mm–6.00mm | 0.2mm–8.00mm |
| Thickness tolerance ( t≥0.8mm) | ±8% | ±5% |
| Thickness tolerance (t＜0.8mm) | ±10% | ±8% |
| Media thickness | 0.076mm–6.00mm | 0.076mm–0.100mm |
| Minimum line width | 0.10mm | 0.075mm |
| Minimum spacing | 0.10mm | 0.075mm |
| Outer copper thickness | 8.75um–175um | 8.75um–280um |
| Inner layer copper thickness | 17.5um–175um | 0.15mm–0.25mm |
| Drilling hole diameter (mechanical drill) | 0.25mm–6.00mm | 0.15mm–0.25mm |
| Hole diameter (mechanical drill) | 0.20mm–6.00mm | 0.10mm–0.20mm |
| Hole Tolerance (Mechanical Drill) | 0.05mm | / |
| Hole tolerance (mechanical drill) | 0.075mm | 0.050mm |
| Laser Drilling Aperture | 0.10mm | 0.075mm |
| Plate thickness aperture ratio | 10：1 | 12：1 |
| Solder mask type | Photosensitive green, yellow, black, purple, blue, ink | / |
| Minimum Solder Mask Bridge Width | 0.10mm | 0.075mm |
| Minimum Solder Mask Isolation Ring | 0.05mm | 0.025mm |
| Plug hole diameter | 0.25mm–0.60mm | 0.60mm-0.80mm |
| Impedance tolerance | ±10% | ±5% |
| Surface treatment type | Hot air leveling, chemical nickel gold, immersion silver, electroplated nickel gold, chemical immersion tin, gold finger card board | Immersion Tin, OSP |
Automatic Solder Paste Printing Machine
AOI Optical Inspection
Smt High-Speed Placement Machine
Nitrogen Reflow Soldering
X-Ray
Three Anti-Paint Spraying Machine
SPI Solder Paste Thickness Tester
Automatic Wave Soldering Machine
First Article Inspection
Our complete turnkey PCB assembly service provides a 24 hour quote service for your turnkey PCB assembly order.
Leadsintec cooperates with world-renowned component suppliers to ensure that the source of electronic components is plastic and the authenticity is guaranteed.
It has 7 fully automatic SMT high-speed chip production lines, equipped with ten temperature zone nitrogen reflow ovens, online AOI, SPI, X-RAY and other equipment.
We have complete ISO9001, ISO13485, ISO14001, IATF 16949, UL and other system certifications, and our products meet environmental protection requirements.
