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Rogers RT5870 High Frequency Board

Rogers RT5870 High Frequency Board

Name: Rogers RT5870 High Frequency Board

Material: Rogers RT5870

Layer: 2L

DK: 2.33

Dielectric Thickness: 0.762mm

Thermal Conductivity: 0.69w/m.k

Volume Resistivity: 1.2*1010

Surface Resistivity: 5.7*109

Finished Thickness: 0.85MM

Surface Treatment: Immersion Gold

Application: Commercial avionics pcb, microstrip and stripline pcb, millimeter wave applications pcb, missile

Rogers PCB

Rogers 4003 PCB

Name: Rogers 4003 PCB

Material: Rogers 4003 material

rogers 4003 dielectric constant: 3.38

Layer: 4003+4450F

rogers 4003 thickness: 0.508mm(20mil)

Finished Thickness: 2.0mm

Rogers 4003 substrate Copper Thickness: 17μm

Finished Copper Thickness: 1OZ

SurfaceTreatment: Immersion Gold

Color:Green /White

Min Trace / Space: 6mil/6mil

Features: Rogers PCB, tg280 high temperature resistant PCB

PCB high frequency microwave

PCB high frequency microwave hybrid PCB

Name: PCB high frequency microwave hybrid plate

Layers: 6 layers

Plate thickness: 1.6±0.14mm

Plate used: Rogers4350B+FR4 Shengyi

Dielectric constant: 2.2±0.02

Dielectric loss factor: 0.0009

Z small aperture: 0.3mm

Surface Treatment: Immersion Gold ENIG

Z line width/spacing: 0.2mm/0.3mm

Process features: special materials, Rogers4350B+FR4 Shengyi mixed lamination

Rogers Printed Circuit Board

Rogers Printed Circuit Board

Name: Rogers Printed Circuit Board(PCB)

Material: rogers PCB material

Quality standard: IPCB6012 Class2 or Class3

Rogers PCB material dielectric constant: 2.2-16

the texture of material: rogers ceramic PCB

Layers: 1layer – multilayer hybrid PCB

Thickness: 0.1mm – 12mm

Copper thickness: 0.5oz – 3oz

Surface technology: Silver, Gold, OSP

Application: High frequency rogers microwave PCB

Rogers RO4003C High Frequency PCB Board

Rogers RO4003C High Frequency PCB Board

Name: Rogers RO4003C High Frequency PCB Board

Darkness: 3.38±0.04

Layers: 2 layers

Dielectric thickness: 0.508mm (20mil)

Finished thickness: 0.6mm

Material Copper Thickness: ½(17μm)

Finished copper thickness: 1OZ (35μm)

Surface treatment: Immersion silver

Applications: Communication infrastructure, computers, aerospace

8-layer 1-stage HDI rigid-flex board

8-layer 1-stage HDI rigid-flex board

Name: 8-layer 1-stage HDI rigid-flex board

Plate: NPG-170

Plate thickness: 1.2 mm

Layers: 8 layers

Minimum line width/line spacing: 3/3 mil

Finished copper thickness: inner layer 0.5OZ, outer layer 1OZ

Acceptance Criteria: IPC6012 CLASS Level 2

Surface Technology: Immersion Gold

Dielectric constant: 4.2

Loss factor: 0.010

Use: medical equipment

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