product

Name: 10-layer 1-stage HDI communication PCB

Layers: 1+8+1

Sheet: FR4 Tg170

Plate thickness: 1.2mm

Panel size: 110.8*94.8mm/4

Outer copper thickness: 35μm

Inner layer copper thickness: 18μm

Minimum through hole: 0.20mm

Minimum blind hole: 0.10mm

Minimum BGA: 0.20mm

Line width and line spacing: 2.5/2.2mil

Surface Treatment: Immersion Gold 2μ”+OSP

Application field: communication

Name: 6L 2+N+2 HDI Communication PCB

Model: 2+N+2 HDI communication PCB

Layers: 6Layers

Material: IT150

Construction : 2+2+2 HDI PCB

Finished Thickness: 0.8mm

Copper Thickness: 0.5OZ

Color: Green/White

Surface Treatment: Immersion Gold+OSP

Min Trace / Space: 3mil/3mil

Min Hole: Laser Hole 0.1mm

Application: Communication HDI PCB

Name: 6L 2+N+2 HDI WiFi Module PCB

Layers: 6Layers

Material: FR4 Tg170

Construction : 2+2+2 HDI PCB

Finished Thickness: 0.8mm

Copper Thickness: 1OZ

Color: Black/White

Surface Treatment: Immersion Gold+OSP

Min Trace / Space: 3mil/3mil

Min Hole: Laser Hole 0.1mm

Application: WiFi module PCB

Name: 6-layer 1-stage HDI PCB

Layers: 1+4+1

Sheet: FR4 Tg150

Plate thickness: 1.6mm

Panel size 105*95mm/1

Outer copper thickness: 35μm

Inner layer copper thickness: 30μm

Minimum through hole: 0.20mm

Minimum blind hole: 0.10mm

Minimum BGA: 0.20mm

Line width line spacing: 3/3mil

Surface Treatment: Immersion Gold 2μ”+OSP

Application field: industrial control

Name: 10-layer 3-stage HDI PCB

Layers: 3+4+3

Sheet: FR4 Tg170

Plate thickness: 1.2mm

Panel size: 126*118mm/4

Outer copper thickness: 35μm

Inner layer copper thickness: 18μm

Minimum through hole: 0.20mm

Minimum blind hole: 0.10mm

Minimum BGA: 0.25mm

Line width and spacing: 2.8/3.2mil

Surface Treatment: Immersion Gold 2μ”+OSP

Name: Cooker hood mother board PCB

Plate: KB6165G

Plate thickness: 1.6mm

Layers: 2L

Size: 82.63*46.7mm

Minimum aperture: 0.296mm

Line width/moment: 0.342*0.37mm

Copper foil thickness: 1/1OZ

Surface treatment: gold plating process

Solder mask/character: black oil and white characters