Smartphones Motherboard High volume PCB
Name: Smartphones Motherboard High volume PCB
Origin: China
Certified: UL, CE, RoHS
Solder resist color: Green; Red; Yellow; Black; White
Material: FR4 CEM1 CEM3 Hight TG
Application: Electronic product
Board thickness: customized
Rigid-Flex Low Volume PCB Assembly – Perfect for Aerospace
Name: Rigid-Flex Low Volume PCB Assembly – Perfect for Aerospace
Origin: China
Certified: UL, CE, RoHS
Base Material: Copper or aluminum
Copper Thickness: 2oz
Surface Finishing: Gold Finger, Immersion Silver, Immersion Tin
Solder mask color: Yellow. Optional
Application: Consumer Electronics
Flex Low Volume PCB Assembly for Digital Cameras and Cell Phones
Name: Flex Low Volume PCB Assembly for Digital Cameras and Cell Phones
Origin: China
Certified: UL, CE, RoHS
Base Material: Copper or aluminum
Surface Finishing: Gold Finger, Immersion Silver, Immersion Tin
Copper Thickness: 2oz
Solder mask color: Yellow. Optional
Board Thickness: customized
High Frequency Low Volume PCB Assembly
Name: High Frequency Low Volume PCB Assembly
Origin: China
Certified: UL, CE, RoHS
Surface Finishing: OSP, HASL, Immersion gold, Immersion Tin etc.
Copper Thickness: 1OZ,2OZ,3OZ 4OZ 5OZ Customization
Board thickness: 0.3-3.5mm
Solder mask: Green ,Black, Blue, Red, white etc.
Heavy Copper Low PCB Assembly for Electronic
Name: Heavy Copper Low PCB Assembly for Electronic
Origin: China
Certified: UL, CE, RoHS
Copper Thickness: 1 oz
Solder Mask Color: Double-sided green LPI, Also support red, white, yellow, blue, black
Board thickness: customized
HDI Low Volume PCB Assembly especially for Equipment
Name: HDI Low Volume PCB Assembly especially for Equipment
Origin: China
Certified: UL, CE, RoHS
Copper Thickness: 4 oz
Application field: LED LIPS
Copper Thickness: 4 oz
Board thickness: Mass production: 394mil(10mm) Samples: 17.5mm
Layer: 1-64 L
Surface finish: HASL, OSP, Immersion Gold/Silver/Tin, ENIG, Gold Finger