Thermoelectric separation copper-based circuit board
Name: Thermoelectric separation copper-based circuit board
Plate thickness: 2.0MM
Copper foil thickness: 3OZ
Thermal conductivity: 398w/m.k
Withstand voltage: AC1500V
Solder mask type: white oil
Surface treatment: OSP
E-T test: 100% computer open and short test
Production process: thermoelectric separation process
Introducing our groundbreaking innovation: the Thermoelectric Separation Copper-Based Circuit Board. This cutting-edge technology revolutionizes the field of electronics by combining the superior conductivity of copper with remarkable thermoelectric properties. It also results in an exceptional circuit board that offers unparalleled performance and reliability.
At the heart of this advanced circuit board is the integration of thermoelectric materials within the copper substrate. This unique combination allows for efficient separation and management of heat, ensuring optimal thermal conductivity and dissipation throughout the system. Unlike traditional circuit boards that rely solely on passive cooling methods, our Thermoelectric Separation Copper-Based Circuit Board actively regulates temperature, preventing overheating and maximizing the longevity of electronic components.
One of the key advantages of this innovative circuit board is its enhanced efficiency in dissipating heat. The thermoelectric materials embedded within the copper substrate actively draw heat away from critical components, effectively reducing the risk of thermal damage and enhancing the overall performance of the system. This superior heat management capability is particularly beneficial for high-performance applications, where temperature control is paramount.
Another notable feature of our Thermoelectric Separation Copper-Based Circuit Board is its exceptional electrical conductivity. Copper has long been favored for its excellent electrical properties, and by integrating thermoelectric materials within the copper substrate, we have created a circuit board that combines the best of both worlds. This translates into superior signal integrity, reduced power losses, and improved overall system efficiency.
Moreover, our Thermoelectric Copper-Based Circuit Board is designed to be highly durable and reliable. The copper substrate provides exceptional mechanical strength, ensuring resistance to physical stresses and vibrations. This robustness makes our circuit board suitable for a wide range of applications, including consumer electronics, telecommunications, automotive, aerospace, and more.
Name: Thermoelectric separation copper-based circuit board
Plate thickness: 2.0MM
Copper foil thickness: 3OZ
Thermal conductivity: 398w/m.k
Withstand voltage: AC1500V
Solder mask type: white oil
Surface treatment: OSP
E-T test: 100% computer open and short test
Production process: thermoelectric separation process