PCB high frequency microwave

PCB high frequency microwave hybrid PCB

Name: PCB high frequency microwave hybrid plate

Layers: 6 layers

Plate thickness: 1.6±0.14mm

Plate used: Rogers4350B+FR4 Shengyi

Dielectric constant: 2.2±0.02

Dielectric loss factor: 0.0009

Z small aperture: 0.3mm

Surface Treatment: Immersion Gold ENIG

Z line width/spacing: 0.2mm/0.3mm

Process features: special materials, Rogers4350B+FR4 Shengyi mixed lamination

Product Details Data Sheet

Introducing the High Frequency Microwave Hybrid PCB, a state-of-the-art solution designed to meet the demanding requirements of high-frequency and microwave applications. This hybrid PCB combines the benefits of high-frequency materials with standard PCB materials.

The High Frequency Microwave Hybrid PCB is specifically engineered for applications that require precise signal transmission, and also high-speed performance.

It integrates specialized high-frequency materials in critical areas of the board, providing excellent electrical properties, low dielectric loss, and consistent impedance control. This ensures efficient signal propagation and minimal signal attenuation. Moreover this also makes it ideal for microwave circuits, radar systems, and other high-frequency applications.

With the rapid development of electronic communication technology, in order to achieve high-speed, high-fidelity signal transmission, more and more microwave RF PCBs are used in communication equipment. Dielectric materials for high-frequency hybrid circuit boards have excellent electrical properties and good chemical stability, mainly in the following four aspects.

 

1. The hybrid PCB has the characteristics of small signal transmission loss, and small signal transmission distortion.

2. Excellent dielectric properties (mainly refers to low relative dielectric constant DK, low dielectric loss factor DF). In addition, the dielectric properties (DK, DF) remain stable under environmental changes.

3. High-precision characteristic impedance control.

4. Hybrid PCB has excellent heat resistance (TG), processability and adaptability.

This hybrid PCB is built to withstand challenging environmental conditions, including temperature variations, moisture, and chemicals. It exhibits excellent resistance to environmental factors. This also ensures long-term durability and reliable operation even in harsh environments.

Microwave High Frequency Hybrid PCB is widely used in wireless antennas, navigation systems and also other communication equipment.

Name: PCB high frequency microwave hybrid plate

Layers: 6 layers

Plate thickness: 1.6±0.14mm

Plate used: Rogers4350B+FR4 Shengyi

Dielectric constant: 2.2±0.02

Dielectric loss factor: 0.0009

Z small aperture: 0.3mm

Surface Treatment: Immersion Gold ENIG

Z line width/spacing: 0.2mm/0.3mm

Process features: special materials, Rogers4350B+FR4 Shengyi mixed lamination

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