ISOLA 370HR High Frequency PCB
Name: ISOLA 370HR PCB
Material: isola 370hr HIGH TG PCB
Df (dissipation factor): 0.021
Dk (dielectric constant): 4.04
Glass transition temperature: TG180℃
Td: 340℃
Number of Layers: 6 layers
Board thickness: 1.0mm
Surface technology: Immersion gold
Copper thickness: 1OZ
Minimum line width/line spacing: 4mil/4mil
Introducing the ISOLA 370HR High-Frequency PCB, designed to meet the demanding requirements of high-frequency applications. Whether you’re working in telecommunications, this cutting-edge PCB is engineered to deliver exceptional performance and also reliability.
The ISOLA 370HR High-Frequency PCB is constructed using a high-quality laminate material that offers outstanding electrical properties. It also ensures excellent signal integrity and minimal signal loss. Moreover, its low dielectric constant and also low dissipation factor enable efficient signal transmission. This also makes it ideal for high-frequency circuits and applications that demand precise and reliable performance.
Designed to handle high-speed data transmission, the ISOLA 370HR High Frequency PCB provides exceptional impedance control. It also reduce signal reflections and ensuring optimal signal quality. This makes it a perfect choice for applications such as RF modules, microwave systems, and high-speed digital circuits.
ISOLA 370HR PCB designed 370HR laminate and prepreg made with a patented high performance 180°C Tg FR-4 multifunctional epoxy system designed for multilayer printed wiring boards requiring maximum thermal performance and reliability (PWB) applications. We manufacture 370HR laminates and prepregs using premium E-glass fabric for superior conductive anode filament (CAF) resistance. 370HR offers excellent thermal performance with a low coefficient of thermal expansion (CTE) and mechanical, chemical and moisture resistance properties that equal or exceed those of traditional FR-4 materials.
The ISOLA High Frequency PCB is used in thousands of PWB designs and has proven to be best in class in thermal reliability. CAF performance, ease of processing and performance in sequential lamination designs.
Name: ISOLA 370HR PCB
Material: isola 370hr HIGH TG PCB
Df (dissipation factor): 0.021
Dk (dielectric constant): 4.04
Glass transition temperature: TG180℃
Td: 340℃
Number of Layers: 6 layers
Board thickness: 1.0mm
Surface technology: Immersion gold
Copper thickness: 1OZ
Minimum line width/line spacing: 4mil/4mil
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