Hybrid PCB Assembly FR4 + RO4350B -Leadsintec

What do FR4 + RO4350B Hybrid PCB Assembly mean?

• The combining of several printed circuit board (PCB) materials on a single board is referred to as a hybrid PCB assembly. It entails merging FR4 material with RO4350B material in the PCB assembly in the case of FR4 and RO4350B. A common PCB substrate material comprised of woven fiberglass fabric coated with epoxy resin is called FR4 (Flame Retardant 4). It is a reasonably priced material with strong mechanical and electrical insulating qualities. FR4 is frequently utilized for traditional PCBs.
• Excellent electrical performance, little signal loss, and consistent dielectric characteristics at high frequencies are all features of the Hybrid PCB Assembly FR4 + RO4350B. The combination of various features and improved performance are made possible by the integration of this assembly in a hybrid PCB assembly. This method is frequently applied when a PCB design calls for both high-frequency and conventional circuitry to be present on the same board.

What Should You Know About FR4 + RO4350B Hybrid PCB Assembly?

In order to meet certain performance criteria, a hybrid PCB assembly combines several materials and technologies on a single printed circuit board (PCB). For mixed-signal or RF (Radio Frequency) applications, it often entails mixing the common FR4 material with high-frequency laminates like RO4350B. The series of high-performance laminates produced by Rogers Corporation includes the high-frequency laminate material RO4350B. It is made especially for high-frequency uses like microwave and RF (Radio Frequency) circuits. What you need to understand about hybrid PCB construction utilizing FR4 and RO4350B is as follows:

• FR4:

Made of woven fiberglass fabric impregnated with epoxy resin, FR4 is a popular and economical PCB material. It is renowned for having exceptional mechanical strength and electrical insulating qualities, making it useful for a range of applications.

• RO4350B:

RO4350B is a ceramic-filled hydrocarbon system used in a high-frequency laminate material. With decreased dielectric loss and less insertion loss, it is intended to offer better electrical performance at high frequencies. Microwave and RF applications frequently employ the RO4350B.

• Hybrid Assembly:

The integration of both materials on a single PCB is the goal of hybrid PCB assembly using FR4 and RO4350B. While high-frequency components, including RF signal channels or transmission lines, are employed in the RO4350B part, the FR4 portion is used for conventional digital or analogue circuitry.

• Signal Isolation:

The ability to separate high-frequency signals from other circuits via hybrid PCB assembly is one of its main benefits. You may reduce interference and preserve the integrity of the signal for delicate RF components by employing the RO4350B in certain locations.

A hybrid PCB assembly utilizing FR4 and RO4350B:

• A hybrid PCB assembly made of this assemblies allows designers to benefit from the advantages of both materials. Hybrid PCB Assembly FR4 + RO4350B preserve cost effectiveness and mechanical durability for the remainder of the circuit while achieving optimized electrical performance for high-frequency parts. It makes it possible to combine many capabilities into a single PCB design, eliminating the need for additional boards and enhancing system performance.

• Design considerations:

It’s important to take the various characteristics into account when developing a hybrid PCB. FR4’s greater dielectric constant than RO4350B’s might have an impact on RF circuit impedance matching and signal propagation. To guarantee the intended performance, designers must carefully determine trace widths, lengths, and other characteristics.