High thermal conductivity copper substrate
Name: High thermal conductivity copper substrate
Plate thickness: 1.0MM
Copper foil thickness: 2OZ
Withstand voltage: AC2000V
Thermal conductivity: 398w/m.k
Solder mask type: black oil
Surface Treatment: Immersion Gold
E-T test: 100% computer open and short test
Production process: thermoelectric separation process
Introducing our high thermal conductivity copper substrate, a game-changing solution designed to address the increasing thermal challenges faced by electronic systems. This innovative substrate offers exceptional heat transfer capabilities. It also allows for efficient thermal management and enhanced performance in a wide range of applications.
At the heart of this breakthrough technology lies the remarkable thermal conductivity of copper. Copper is renowned for its outstanding ability to conduct heat, surpassing many other metals commonly used in electronic substrates. By leveraging the exceptional thermal properties of copper, our substrate enables rapid heat dissipation. It also effectively mitigating the risk of overheating and ensuring optimal operating conditions for electronic components.
One of the key advantages of our high thermal conductivity copper substrate is its ability to conduct heat quickly and efficiently. This property facilitates the rapid transfer of heat away from heat-generating components, effectively reducing thermal resistance and preventing the buildup of hotspots that can degrade system performance. By maintaining lower operating temperatures, our copper substrate helps extend the lifespan and also reliability of electronic devices.
In addition to its impressive thermal properties, our copper substrate also provides excellent electrical conductivity. Copper has long been favored for its superior electrical characteristics. This ensures minimal signal loss and efficient power transmission within electronic circuits. This feature enables reliable signal integrity and enhanced performance, particularly in high-frequency and high-power applications.
Furthermore, our high thermal conductivity copper substrate exhibits remarkable mechanical strength and durability. Copper is inherently robust and resistant to deformation, making it an ideal choice for applications that require reliable structural integrity. Its ability to withstand physical stresses and vibrations ensures the longevity and reliability.
Our high thermal copper substrate is poised to revolutionize a wide range of industries, including power electronics, automotive, telecommunications, and more.
Name: High thermal conductivity copper substrate
Plate thickness: 1.0MM
Copper foil thickness: 2OZ
Withstand voltage: AC2000V
Thermal conductivity: 398w/m.k
Solder mask type: black oil
Surface Treatment: Immersion Gold
E-T test: 100% computer open and short test
Production process: thermoelectric separation process