10-layer Rigid immersion gold PCB

Introducing the 10-layer Rigid Immersion Gold PCB (Printed Circuit Board), a high-performance and reliable solution for complex electronic designs that require a multi-layer structure and exceptional surface finish. This 10-layer PCB is designed to meet the demands of advanced electronic applications, offering superior electrical performance, durability, and a high-quality gold finish.

The 10-layer Rigid Immersion Gold PCB features ten layers of copper traces and laminated substrate, providing ample space for intricate and densely packed designs. This multi-layer structure allows for efficient signal routing, power distribution, and noise reduction, resulting in improved signal integrity and overall system performance.

The immersion gold finish on the PCB provides several advantages. It offers excellent solderability, ensuring reliable and consistent solder joints during assembly. The gold surface also provides superior corrosion resistance, protecting the PCB from environmental factors and ensuring long-term reliability.

10-layer Rigid immersion gold PCB Features

The crystal structure formed by immersion gold is easier to weld than other surface treatments, and can have better performance and ensure quality;

Because the immersion gold board only has nickel gold on the pad, it will not affect the signal, because the transmission of the signal in the skin effect is in the copper layer.

The metal properties of gold are relatively stable, the crystal structure is more compact, and the oxidation reaction is not easy to occur.

Because the immersion gold board only has nickel-gold on the pad, the combination of the solder mask on the line and the copper layer is stronger, and it is not easy to cause micro-short circuit.

The project will not affect the spacing when compensating.

The stress of the immersion gold plate is easier to control.