10-layer 2-stage HDI rigid-flex board
Name: 10-layer 2-stage HDI rigid-flex board
Plate: Taiguang EM-888S
Plate thickness: 1.0 mm
Layers: 10 layers
Minimum line width/line spacing: 4/4mil
Finished copper thickness: inner layer 0.5OZ, outer layer 1OZ
Acceptance Criteria: IPC6012 CLASS Level 3
Surface Technology: Immersion Gold
Dielectric constant: 3.8
Loss factor: 0.0055
Use: security monitoring equipment
Introducing the 10-layer 2-stage HDI (High-Density Interconnect) Rigid-Flex Board, an advanced and versatile solution designed for complex electronic applications that demand high-density interconnections, flexibility, and compact form factors. This rigid-flex board combines the benefits of rigid and flexible substrates, offering exceptional functionality and design flexibility.
The 10-layer 2-stage HDI Rigid-Flex Board features ten layers of circuitry, providing ample space for intricate and densely packed designs. It leverages advanced HDI technology to achieve high-density interconnections with smaller vias, finer traces, and tight spacing between components. This results in improved signal integrity, reduced crosstalk, and enhanced electrical performance.
The 2-stage design of the board further enhances design flexibility and versatility. It allows for the incorporation of multiple rigid and flexible sections, enabling optimal component placement and efficient signal routing. This facilitates efficient power distribution, noise reduction, and effective thermal management.
The HDI construction of the board ensures precise impedance control, impedance matching, and controlled signal propagation, minimizing signal reflections and ensuring accurate signal transmission. This makes it well-suited for applications that demand high-speed data transfer, such as telecommunications, high-speed computing, and aerospace.
The rigid-flex design offers a combination of mechanical stability in the rigid sections and flexibility in the flexible sections. This allows the board to conform to complex shapes, bend, twist, or fold, making it suitable for space-constrained environments and applications that require intricate geometries.
The 10-layer 2-stage HDI Rigid-Flex Board delivers excellent reliability and durability. It is specifically designed to withstand repeated bending and flexing without compromising the performance or integrity of the circuitry, ensuring long-term operation even in demanding conditions.
Check our new product 8-layer rigid-flex PCB board
Name: 10-layer 2-stage HDI rigid-flex board
Plate: Taiguang EM-888S
Plate thickness: 1.0 mm
Layers: 10 layers
Minimum line width/line spacing: 4/4mil
Finished copper thickness: inner layer 0.5OZ, outer layer 1OZ
Acceptance Criteria: IPC6012 CLASS Level 3
Surface Technology: Immersion Gold
Dielectric constant: 3.8
Loss factor: 0.0055
Use: security monitoring equipment
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