8-layer 1-stage HDI rigid-flex board
Name: 8-layer 1-stage HDI rigid-flex board
Plate: NPG-170
Plate thickness: 1.2 mm
Layers: 8 layers
Minimum line width/line spacing: 3/3 mil
Finished copper thickness: inner layer 0.5OZ, outer layer 1OZ
Acceptance Criteria: IPC6012 CLASS Level 2
Surface Technology: Immersion Gold
Dielectric constant: 4.2
Loss factor: 0.010
Use: medical equipment
10-layer 2-stage HDI rigid-flex board
Name: 10-layer 2-stage HDI rigid-flex board
Plate: Taiguang EM-888S
Plate thickness: 1.0 mm
Layers: 10 layers
Minimum line width/line spacing: 4/4mil
Finished copper thickness: inner layer 0.5OZ, outer layer 1OZ
Acceptance Criteria: IPC6012 CLASS Level 3
Surface Technology: Immersion Gold
Dielectric constant: 3.8
Loss factor: 0.0055
Use: security monitoring equipment
8-layer 2-stage HDI rigid-flex board
Name: 8-layer 2-stage HDI rigid-flex board
Layers: 8L
Structure: 3F+5R (8-layer 2-level HDI)
Sheet Type: PI, PET, PEN
Minimum hole: 0.1mm
PI thickness: 0.5mil-2mil
Cu Thickness: 1/3oz-2oz
Minimum line width/line spacing: 0.1/0.1mm;
NPTH Finished Aperture Tolerance: ±1mil(±0.025mm)
PTH Finished Aperture Tolerance: ±2mil(±0.050mm)
Finished plate thickness tolerance: ±0.01mm
Minimum line width/line gap: 0.05/0.05mm
Application field: High-end precision industrial sensor control board
10-layer 2-stage HDI rigid-flex board
Name: 10-layer 2-stage HDI rigid-flex board
Plate: Taiguang EM-888S
Plate thickness: 1.0 mm
Layers: 10 layers
Minimum line width/line spacing: 4/4mil
Finished copper thickness: inner layer 0.5OZ, outer layer 1OZ
Acceptance Criteria: IPC6012 CLASS Level 3
Surface Technology: Immersion Gold
Dielectric constant: 3.8
Loss factor: 0.0055
Use: security monitoring equipment
Name: 8-layer rigid-flex PCB board
Layers: 8L
Plate thickness: 1.45mm
Minimum aperture: 0.25mm
Minimum line width/line spacing: 5/3.6mil
Inner layer copper thickness: HOZ
Outer copper thickness: 1OZ
Surface treatment: chemical gold ENIG
Minimum distance from hole to line: 0.25mm
Application field: consumer electronics
Name: 8L rigid-flex board
Layers: 8L
Plate thickness: 1.45mm
Minimum aperture: 0.25mm
Minimum line width/line spacing: 5/3.6mil
Inner layer copper thickness: HOZ
Outer copper thickness: 1OZ
Surface treatment: chemical gold ENIG
Minimum distance from hole to line: 0.25mm
Application field: consumer electronics
- Description
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