- PCB Assembly Capability
The Military Applications PCBA (Printed Circuit Board Assembly) is a cutting-edge technology specifically designed to meet the demanding requirements of military applications. Built with a focus on power, reliability, and precision, this PCBA offers unmatched performance in the most challenging and mission-critical environments.
Its robust construction and high-quality components ensure durability and longevity, reducing the need for frequent replacements. This, in turn, leads to cost savings in terms of maintenance, repairs, and system upgrades, enabling military organizations to allocate resources effectively.
With its unparalleled performance, this PCBA also offers numerous advantages that make it an essential component for military operations.
Advantages of Military Applications PCBA:
- Superior Performance: The Military Applications harness the latest advancements in electronic components and processing power, enabling unparalleled performance in military operations. With high-speed data processing and rapid decision-making capabilities, this PCBA empowers military personnel to gain a tactical advantage in critical situations.
- Enhanced Reliability: Designed to operate flawlessly even in the harshest conditions, the Military Applications PCBA ensures uninterrupted performance in extreme environments. It undergoes stringent testing and adheres to rigorous military-grade standards to withstand shocks, vibrations, and electromagnetic interference. It also minimizes the risk of system failures during crucial missions.
- Robust Security Measures: Information security is of utmost importance in military operations. The Military Applications PCBA incorporates advanced encryption algorithms, secure boot mechanisms, and physical tamper-resistant features to protect sensitive data and prevent unauthorized access. With multiple layers of security, this PCBA also ensures the integrity and confidentiality of critical information.
- Versatile Connectivity: The Military Applications PCBA offers extensive connectivity options to seamlessly integrate with a wide range of military systems and platforms. It supports various communication protocols, data interfaces, and peripheral devices. This also enables efficient interoperability and collaboration among different units and systems within the military ecosystem.
- Scalability and Customization: The Military Applications PCBA is designed to adapt to evolving military needs. Its modular architecture allows for easy customization and scalability, ensuring compatibility with future technology advancements and system upgrades. This flexibility also enables military forces to stay ahead of the curve and rapidly deploy the latest innovations.
SMT capacity: 19 million points/day | ||
Testing Equipment | X-RAY Nondestructive Tester, First Piece Tester, AOI Automatic Optical Tester, ICT Tester, BGA Rework Station | |
Placement speed | Chip placement speed (at best conditions) 0.036 S/piece | |
Mounted Component Specifications | Pasteable smallest package | |
Minimum device accuracy | ||
IC type chip accuracy | ||
Mounted PCB Specifications | Substrate size | |
Substrate thickness | ||
throw rate | 1. Resistance-capacitance ratio 0.3% | |
2. IC type without throwing material | ||
Board Type | POP/common board/FPC/rigid-flex board/metal substrate | |
DIP daily production capacity | ||
DIP plug-in production line | 50000 points/day | |
DIP post welding production line | 20000 points/day | |
DIP test production line | 50000pcs PCBA/day | |
Assembly processing capability | ||
The company has more than 10 advanced assembly production lines, dust-free and anti-static air-conditioning workshop, TP dust-free workshop, equipped with aging room, test room, functional test isolation room, advanced and perfect equipment, can carry out various product assembly, packaging, testing, Aging, etc. production. Monthly production capacity can reach 150,000 to 300,000 sets/month | ||
PCBA processing capability | ||
project | Mass processing capability | Small batch processing capability |
Number of layers (max) | 2-18 | 20-30 |
Plate type | FR-4, Ceramic Sheet, Aluminum Base Sheet PTFE, Halogen Free Sheet, High Tg Sheet | PTFE, PPO, PPE |
Rogers,etc Teflon | E-65, ect | |
Sheet mixing | 4 layers – 6 layers | 6th floor – 8th floor |
biggest size | 610mm X 1100mm | / |
Dimensional Accuracy | ±0.13mm | ±0.10mm |
Plate thickness range | 0.2mm–6.00mm | 0.2mm–8.00mm |
Thickness tolerance ( t≥0.8mm) | ±8% | ±5% |
Thickness tolerance (t<0.8mm) | ±10% | ±8% |
Media thickness | 0.076mm–6.00mm | 0.076mm–0.100mm |
Minimum line width | 0.10mm | 0.075mm |
Minimum spacing | 0.10mm | 0.075mm |
Outer copper thickness | 8.75um–175um | 8.75um–280um |
Inner layer copper thickness | 17.5um–175um | 0.15mm–0.25mm |
Drilling hole diameter (mechanical drill) | 0.25mm–6.00mm | 0.15mm–0.25mm |
Hole diameter (mechanical drill) | 0.20mm–6.00mm | 0.10mm–0.20mm |
Hole Tolerance (Mechanical Drill) | 0.05mm | / |
Hole tolerance (mechanical drill) | 0.075mm | 0.050mm |
Laser Drilling Aperture | 0.10mm | 0.075mm |
Plate thickness aperture ratio | 10:1 | 12:1 |
Solder mask type | Photosensitive green, yellow, black, purple, blue, ink | / |
Minimum Solder Mask Bridge Width | 0.10mm | 0.075mm |
Minimum Solder Mask Isolation Ring | 0.05mm | 0.025mm |
Plug hole diameter | 0.25mm–0.60mm | 0.60mm-0.80mm |
Impedance tolerance | ±10% | ±5% |
Surface treatment type | Hot air leveling, chemical nickel gold, immersion silver, electroplated nickel gold, chemical immersion tin, gold finger card board | Immersion Tin, OSP |