Metal Core PCB

Metal Core PCB

2OZ oz aluminum circuit board

2OZ oz aluminum circuit board

Name: 2OZ oz aluminum base circuit board

Number of layers: single-sided aluminum substrate

Plate thickness: 2.0MM

Copper thickness: 2OZ oz

Color: white text

Surface treatment: spray tin process

Breakdown voltage: 3000V

Thermal conductivity – thermal conductivity (W/m-k): 2.0

Application field: LED lighting

Thermoelectric separation copper-based circuit board

Thermoelectric separation copper-based circuit board

Name: Thermoelectric separation copper-based circuit board

Plate thickness: 2.0MM

Copper foil thickness: 3OZ

Thermal conductivity: 398w/m.k

Withstand voltage: AC1500V

Solder mask type: white oil

Surface treatment: OSP

E-T test: 100% computer open and short test

Production process: thermoelectric separation process

High thermal conductivity aluminum-based circuit board

High thermal conductivity aluminum-based circuit board

Name: High thermal conductivity aluminum base circuit board

Number of layers: single-layer aluminum substrate

Plate thickness: 1.5MM

Copper thickness: 1OZ

Surface treatment: tin spray

Color: white oil black

Thermal conductivity: 3.0 (W/mk)

Withstand voltage KV: 1.5-3.5KV/AC

Application field: mining machine lighting

High thermal conductivity copper substrate

High thermal conductivity copper substrate

Name: High thermal conductivity copper substrate

Plate thickness: 1.0MM

Copper foil thickness: 2OZ

Withstand voltage: AC2000V

Thermal conductivity: 398w/m.k

Solder mask type: black oil

Surface Treatment: Immersion Gold

E-T test: 100% computer open and short test

Production process: thermoelectric separation process

Copper base circuit board

Copper base circuit board

Product name: Copper base circuit board

Plate thickness: 1.6MM

Copper foil thickness: 2OZ

Withstand voltage: AC2000V

Thermal conductivity: 398w/m.k

Solder mask type: white oil

Surface treatment: OSP

E-T test: 100% computer open and short test

Production process: thermoelectric separation process

Double Sided Metal Core Copper Base MC PCB

Double Sided Metal Core Copper Base MC PCB

Name: Double Sided Metal Core Copper Base MC PCB

PCB material: metal core copper base

Layers: 2

Copper weight: 6OZ

Solder mask: blue

Outline: Wiring, Punching, V-Cut

Solder mask: white/black/blue/green/red oil

Legend/Silkscreen Color: Black/White

Surface treatment: immersion gold, spray tin, OSP

Packing: vacuum/polybag

Introducing our metal core PCB (MCPCBs), a specialized type of printed circuit board designed to provide excellent thermal management for high-power electronic applications. Our MCPCBs feature a metal core, typically aluminum or copper, which offers superior heat dissipation properties compared to traditional FR4 PCBs.

Our metal core PCBs are ideal for applications that require efficient heat transfer, such as LED lighting, power electronics, automotive lighting, and high-power electronic devices.

 

With their enhanced thermal conductivity and reliability, our MCPCBs ensure optimal performance and longevity of electronic systems operating under high-temperature conditions.

 

Metal Core PCBs (Printed Circuit Boards) are specialized circuit boards that have a metal core, typically aluminum or copper, as the base material instead of the traditional FR4 (Flame Retardant 4) material. The metal core provides improved heat dissipation and thermal management, making them suitable for applications that require efficient heat transfer.

The capability of Metal Core PCBs depends on several factors, including the manufacturing processes and materials used. Here are some key considerations:

  1. Metal Core Selection: The choice of metal core material affects the performance of the PCB. Aluminum and copper are commonly used due to their excellent thermal conductivity. Copper offers better conductivity but is costlier than aluminum.
  2. Layer Count: Metal Core PCBs can have multiple layers similar to standard FR4 PCBs. The layer count determines the complexity and functionality of the PCB.
  3. Heat Dissipation: Metal Core PCBs excel in dissipating heat generated by power components. The metal core acts as a heat sink, transferring heat away from heat-generating components to the surrounding environment.
  4. Copper Weight: The thickness of the copper layer affects the current-carrying capacity of the PCB traces. Typically, Metal Core PCBs have thicker copper layers to enhance their thermal and electrical performance.
  5. Dielectric Layer: The dielectric layer, also known as the insulating layer, separates the metal core from the copper traces. The choice of dielectric material affects the electrical properties and thermal conductivity of the PCB.
  6. Component Assembly: Metal Core PCBs support the same range of components as standard PCBs. Surface mount technology (SMT) and through-hole components can be used depending on the design requirements.
  7. Manufacturing Techniques: Metal Core PCBs are manufactured using similar processes as standard PCBs, including etching, plating, solder mask application, and component assembly. However, specialized techniques may be required to handle the unique characteristics of metal core materials.
  8. Design Considerations: Metal Core PCBs require careful consideration of thermal management and mechanical stability. Proper heat sinking, component placement, and thermal vias are essential to optimize the thermal performance.

Advantages of Metal Core PCB:

  1. Thermal Management: Metal core PCBs are specifically engineered to address thermal management challenges. The metal core acts as a highly conductive heat sink, efficiently dissipating heat generated by high-power components, such as LEDs or power transistors. This ensures reliable operation and prevents thermal damage to sensitive components.
  2. Enhanced Heat Dissipation: The metal core of our MCPCBs provides superior thermal conductivity compared to traditional PCB materials. Aluminum and copper, commonly used as metal cores, have excellent heat transfer properties. It allows for efficient dissipation of heat from the active components to the surrounding environment.
  3. Improved Power Handling: MCPCBs can handle higher power levels compared to standard FR4 PCBs. The metal core effectively spreads and dissipates heat, enabling electronic components to operate at their optimal power ratings without overheating. This results in increased power handling capacity and improved performance of high-power applications.
  4. Design Flexibility: Metal core PCBs offer design flexibility, allowing for the integration of different components and technologies. They support surface-mounted devices (SMDs), through-hole components, and can accommodate complex circuit layouts and high-density designs. This enables the realization of compact and efficient electronic systems.
  5. Electrical Isolation: Metal core PCBs provide electrical isolation between the metal core and the circuit traces. The metal core is electrically insulated using an appropriate dielectric layer. It ensures  safe operation and preventing short circuits or electrical interference.

 

Item Capability
Layer Count 1-40layers
Base Material KB、Shengyi、ShengyiSF305、FR408、FR408HR、IS410、FR406、GETEK、370HR、IT180A、Rogers4350B、Rogers4000、PTFE Laminates(Rogers series、Taconic series、Arlon series、Nelco series)、Rogers/Taconic/Arlon/Nelco laminate with FR-4 material(including partial Ro4350B hybrid laminating with FR-4)
Board Type Backplane、HDI、High multi-layer 、blind&buried PCB、Embedded Capacitance、Embedded resistance board 、Heavy copper power PCB、Backdrill.
Board Thickness 0.2-5.0mm
Copper Thickness Min. 1/2 OZ, Max. 10 OZ
PTH Wall 25um(1mil)
Maximum Board Size 1100*500mm(43”*19”)
Min laser drilling size 4mil
Min. Spacing/Tracing 2.7mil/2.7mil
Solder Mask Green, Black, Blue, Red, White, Yellow, Purple matte/glossy
Surface Treatment Flash gold(electroplated gold)、ENIG、Hard gold、Flash gold、HASL Lead-free 、OSP、ENEPIG、Soft gold、Immersion silver、Immersion Tin、ENIG+OSP, ENIG+Gold finger, Flash gold(electroplated gold)+Gold finger, Immersion silver+Gold finger, Immersion Tin+Gold finger.
Min. Annular Ring 3mil
Aspect ratio 10:1(HASL Lead-free 、HASL Lead、ENIG、Immersion Tin、Immersion silver、ENEPIG);8:1(OSP)
Impedance control ±5ohm(<50ohm), ±10%(≥50ohm)
Other Techniques Blind/Buried Via
Gold Fingers
Press Fit
Via in Pad
Electrical Test
https://www.made-in-pcb.com/wp-content/uploads/2023/05/PCB-Drilling-machine.webp

PCB Drilling machine

https://www.made-in-pcb.com/wp-content/uploads/2023/05/PCB-pattern-plating-line.webp

PCB pattern plating line

https://www.made-in-pcb.com/wp-content/uploads/2023/05/PCB-solder-mask-expose-machine.webp

PCB solder mask expose machine

https://www.made-in-pcb.com/wp-content/uploads/2023/05/PCB-pattern-expose-machine.webp

PCB pattern expose machine

https://www.made-in-pcb.com/wp-content/uploads/2023/05/Strip-film-etching-line.webp

Strip film etching line

https://www.made-in-pcb.com/wp-content/uploads/2023/05/Solder-mask-screen-silk-print-machine.webp

Solder mask screen silk print machine

https://www.made-in-pcb.com/wp-content/uploads/2023/05/Solder-mask-scrubbing-line.webp

Solder mask scrubbing line

https://www.made-in-pcb.com/wp-content/uploads/2023/05/PCB-Flying-Probe-Test-FPT.webp

PCB Flying Probe Test (FPT)

https://www.made-in-pcb.com/wp-content/uploads/2023/05/Fully-automatic-exposure-machine.webp

Fully automatic exposure machine

Leadsintec
Why choose us?
24-hour customer service

we provide 24-hour service and support, you will receive a reply to your question within 2 hours and a quotation within 24 hours.

timely delivery

Own PCB factory of 50,000 square meters, the monthly output can reach 60,000 square meters, no minimum PCB order requirements

Free DFM service

Before the official production of the PCB, we will conduct a free DFM review service and support free Allegro, Altium, Protel, PADS, OBD, Gerber and other formats.

Quality assura

We can provide you with high frequency, high TG, high CTI, buried blind via, aluminum based PCB manufacturing, the quality is fully compliant with IPC 610-D standard, testing and quality assurance

Leadsintec
Metal Core Circuit Board FAQs
1.What is a Metal Core Circuit Board?
A Metal Core Circuit Board (MCPCB), also known as a Metal Core PCB (MCPCB), is a type of printed circuit board that uses a metal core as its base material instead of the traditional FR4 material. The metal core provides improved thermal conductivity and heat dissipation, making MCPCBs suitable for applications with high-power components that generate a significant amount of heat.
2. What are the advantages of Metal Core Circuit Boards?
MCPCBs offer several advantages, including: Enhanced heat dissipation: The metal core acts as a heat sink, efficiently transferring heat away from heat-generating components. Improved thermal management: MCPCBs can withstand higher temperatures, ensuring the stability and reliability of the circuitry. High power capability: MCPCBs are suitable for high-power applications that require efficient heat dissipation. Compact size: Due to better heat management, MCPCBs often allow for more compact designs. Reduced thermal expansion mismatch: The metal core has a similar coefficient of thermal expansion (CTE) to power components, minimizing stress and the risk of failure.
3. What are the common metal core materials used in MCPCBs?
The most commonly used metal core materials are aluminum and copper. Aluminum offers good thermal conductivity, is lightweight, and cost-effective. Copper has superior thermal conductivity but is more expensive. The choice of metal core material depends on specific design requirements and budget considerations.
4. Can MCPCBs be manufactured with multiple layers?
Yes, MCPCBs can be manufactured with multiple layers, similar to traditional PCBs. Multilayer MCPCBs are used when complex circuitry or signal integrity considerations are required.
5: What are the typical applications of Metal Core Circuit Boards?
MCPCBs find applications in various industries, including: LED lighting: MCPCBs are commonly used in high-power LED applications, where efficient heat dissipation is crucial for the longevity and performance of LEDs. Power electronics: MCPCBs are used in power supplies, motor control, inverters, and other high-power electronic devices. Automotive: MCPCBs are used in automotive lighting, engine control units, and electric vehicle power systems. RF/microwave: MCPCBs can be utilized in high-frequency applications where thermal management is important.
6: What considerations should be taken during MCPCB design?
Designing MCPCBs requires attention to thermal management and mechanical stability. Some key considerations include: Proper heat sinking and placement of heat-generating components. Thermal vias to facilitate heat transfer between the metal core and copper layers. Mechanical compatibility of the metal core material with the components to prevent stress-related failures. Adequate insulation and dielectric layer selection to maintain electrical isolation and proper thermal conductivity.
7: Can standard components be used with MCPCBs?
Yes, MCPCBs can accommodate standard surface mount technology (SMT) and through-hole components. They are compatible with common components used in electronic assemblies.
8: Are MCPCBs more expensive than standard FR4 PCBs?
MCPCBs can be more expensive than standard FR4 PCBs due to the use of metal core materials and additional manufacturing processes required for thermal management. The cost will depend on factors such as metal core material, layer count, complexity, and quantities. It's advisable to consult with PCB manufacturers or suppliers to get accurate pricing for your specific requirements.
9: Are there any limitations to using MCPCBs?
While MCPCBs offer several advantages, they do have some limitations to consider: Cost: MCPCBs can be more expensive than standard FR4 PCBs due to the use of metal core materials. Machining: MCPCBs may require specialized machining techniques due to the hardness of metal core materials. Insulation: Adequate insulation and dielectric layer selection are essential to prevent electrical shorts. Design complexity: MCPCBs may require additional design considerations for heat sinking and thermal management.

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