Best Antenna PCB Manufacturer in China
Name: Best Antenna PCB Manufacturer in China
Origin: China
Certified: UL, CE, RoHS
Base Material: FR4, Rogers
Copper Thickness: 0.5-6oz
Board Thickness: customized
Solder Mask Color: Blue. green. red. black. white. etc
Industrial Bluetooth PCB Assembly Manufacturer in China
Name: Industrial Bluetooth PCB Assembly Manufacturer in China
Origin: China
Certified: UL, CE, RoHS
Number of Layers: 4-layer
Base Material: FR4
Copper Thickness: 1oz~4oz
Board Thickness: customized
Surface Finishing: HASL
Solder Mask: Green. Red. Blue. White. Black. Yellow
Automotive PCB Assembly Applications for Heavy Duty Applications
Name: Automotive PCB Assembly Applications for Heavy Duty Applications
Origin: China
Certified: UL, CE, RoHS
Base Material: FR-4
Board Thickness: customized
Surface Finishing: HASL Lead Free
Microwave PCB Manufacturer PCB Assembly
Name: Microwave PCB Manufacturer PCB Assembly
Origin: China
Certified: UL, CE, RoHS
Copper Thickness: 2 OZ, 1OZ 2OZ 3OZ 4OZ 5OZ
Application field: Household Appliance; Medical Products; Consumer Electronics
Material: FR-4, glass epoxy, FR4 High Tg, Rohs compliant, Aluminum
Industrial Air Conditioner PCB Assembly- Leadsintec
Name: Industrial Air Conditioner PCB Assembly- Leadsintec
Origin: China
Certified: UL, CE, RoHS
Application: Home Appliances
Surface Finishing: HASL\OSP\ENIG
Material: FR4 High Tg
Solder mask: Black Green Blue Red Yellow
Copper Thickness: Customize
Aerospace PCB Assembly Manufacturer in China
Name: Aerospace PCB Assembly Manufacturer in China
Origin: China
Certified: UL, CE, RoHS
Solder mask color: Yellow; Black; White;
Application: Electronic product
Copper Thickness: 1 oz
Material: FR4 CEM1 CEM3 Hight TG
- PCB Assembly Capability
- PCB Assembly Equipment
Industrial PCB Assembly is a specialized electronic manufacturing service that caters to the unique requirements of industrial applications. It also involves the assembly of printed circuit boards (PCBs) specifically designed for industrial equipment, machinery, and other industrial applications.
Industrial PCB Assembly focuses on providing robust and reliable electronic assemblies that can withstand harsh operating environments, and electromagnetic interference (EMI). It also incorporates components and design considerations that meet the stringent demands of industrial applications.
Advantages of Industrial PCB Assembly:
- Rugged and Durable Design: Industrial Assembly emphasizes the use of durable materials, robust components, and ruggedized designs to ensure reliability in demanding industrial environments. The PCBs are designed to withstand temperature fluctuations, vibrations, shocks, and exposure to dust, moisture, and also corrosive substances.
- Extended Temperature Range: Industrial PCB considers the extended temperature ranges often encountered in industrial settings. The selection of components, soldering techniques, and PCB materials are optimized to operate reliably across a wide temperature range. This also ensures consistent performance under extreme conditions.
- EMI/EMC Compliance: Industrial environments are prone to electromagnetic interference (EMI) and require electronic assemblies to comply with electromagnetic compatibility (EMC) standards. Industrial PCB incorporates shielding techniques, grounding strategies, and component placement considerations to minimize EMI and ensure compliance with regulatory requirements.
- High Component Reliability: Industrial PCB Assembly utilizes components known for their reliability and longevity. Industrial-grade components with extended lifecycles, higher temperature ratings, and enhanced resistance to environmental factors are selected to ensure the longevity and consistent performance of the assembled PCBs.
- Robust Power Management: Industrial applications often require efficient power management and distribution. Industrial PCB incorporates power management components, such as voltage regulators, to ensure stable and clean power supply to the system. This also minimize the risk of voltage fluctuations or power surges.
| SMT capacity: 19 million points/day | ||
| Testing Equipment | X-RAY Nondestructive Tester, First Piece Tester, AOI Automatic Optical Tester, ICT Tester, BGA Rework Station | |
| Placement speed | Chip placement speed (at best conditions) 0.036 S/piece | |
| Mounted Component Specifications | Pasteable smallest package | |
| Minimum device accuracy | ||
| IC type chip accuracy | ||
| Mounted PCB Specifications | Substrate size | |
| Substrate thickness | ||
| throw rate | 1. Resistance-capacitance ratio 0.3% | |
| 2. IC type without throwing material | ||
| Board Type | POP/common board/FPC/rigid-flex board/metal substrate | |
| DIP daily production capacity | ||
| DIP plug-in production line | 50000 points/day | |
| DIP post welding production line | 20000 points/day | |
| DIP test production line | 50000pcs PCBA/day | |
| Assembly processing capability | ||
| The company has more than 10 advanced assembly production lines, dust-free and anti-static air-conditioning workshop, TP dust-free workshop, equipped with aging room, test room, functional test isolation room, advanced and perfect equipment, can carry out various product assembly, packaging, testing, Aging, etc. production. Monthly production capacity can reach 150,000 to 300,000 sets/month | ||
| PCBA processing capability | ||
| project | Mass processing capability | Small batch processing capability |
| Number of layers (max) | 2-18 | 20-30 |
| Plate type | FR-4, Ceramic Sheet, Aluminum Base Sheet PTFE, Halogen Free Sheet, High Tg Sheet | PTFE, PPO, PPE |
| Rogers,etc Teflon | E-65, ect | |
| Sheet mixing | 4 layers – 6 layers | 6th floor – 8th floor |
| biggest size | 610mm X 1100mm | / |
| Dimensional Accuracy | ±0.13mm | ±0.10mm |
| Plate thickness range | 0.2mm–6.00mm | 0.2mm–8.00mm |
| Thickness tolerance ( t≥0.8mm) | ±8% | ±5% |
| Thickness tolerance (t＜0.8mm) | ±10% | ±8% |
| Media thickness | 0.076mm–6.00mm | 0.076mm–0.100mm |
| Minimum line width | 0.10mm | 0.075mm |
| Minimum spacing | 0.10mm | 0.075mm |
| Outer copper thickness | 8.75um–175um | 8.75um–280um |
| Inner layer copper thickness | 17.5um–175um | 0.15mm–0.25mm |
| Drilling hole diameter (mechanical drill) | 0.25mm–6.00mm | 0.15mm–0.25mm |
| Hole diameter (mechanical drill) | 0.20mm–6.00mm | 0.10mm–0.20mm |
| Hole Tolerance (Mechanical Drill) | 0.05mm | / |
| Hole tolerance (mechanical drill) | 0.075mm | 0.050mm |
| Laser Drilling Aperture | 0.10mm | 0.075mm |
| Plate thickness aperture ratio | 10：1 | 12：1 |
| Solder mask type | Photosensitive green, yellow, black, purple, blue, ink | / |
| Minimum Solder Mask Bridge Width | 0.10mm | 0.075mm |
| Minimum Solder Mask Isolation Ring | 0.05mm | 0.025mm |
| Plug hole diameter | 0.25mm–0.60mm | 0.60mm-0.80mm |
| Impedance tolerance | ±10% | ±5% |
| Surface treatment type | Hot air leveling, chemical nickel gold, immersion silver, electroplated nickel gold, chemical immersion tin, gold finger card board | Immersion Tin, OSP |
Automatic Solder Paste Printing Machine
AOI Optical Inspection
Smt High-Speed Placement Machine
Nitrogen Reflow Soldering
X-Ray
Three Anti-Paint Spraying Machine
SPI Solder Paste Thickness Tester
Automatic Wave Soldering Machine
First Article Inspection
