High Frequency Hybrid PCB Board

Introducing the High Frequency Hybrid PCB Board, a versatile and powerful solution that combines the benefits of high-frequency materials and standard PCB materials. It delivers exceptional performance in high-frequency applications. This hybrid PCB board offers a balance between performance, cost-effectiveness, and ease of manufacturing.

The High Frequency Hybrid PCB Board is specifically designed for applications that require precise signal transmission. By integrating high-frequency materials in critical areas of the board, we ensure excellent signal integrity. Moreover, this also enables optimal performance in high-frequency circuits.

Where is the high frequency mixing board used?

Satellite receivers, base station antennas, microwave transmission, car phones, global positioning systems, satellite communications, communication equipment connectors, receivers, signal oscillators, home appliance networking, high-speed running computers, oscilloscopes, IC testing instruments, etc., high-frequency communications. High-frequency microwave printed boards are required in communication and also computer fields such as medium-frequency communication, and high storage capacity processing.

Microwave high-frequency hybrid PCB stacking method and characteristics

1. A high-frequency hybrid PCB controlled depth composite laminate structure, the high-frequency hybrid PCB includes L1 copper layer (high frequency sheet), L2 copper layer (PP sheet), L3 copper layer (epoxy resin substrate), L4 in order Copper layer; slot holes of the same size are set in the same position of L2, L3, and also L4 copper layer; L4. The copper layer is arranged with three-in-one buffer material from inside to outside, steel plate and also kraft paper are stacked from outside to outside in turn.

2. Three-in-one buffer material is a buffer material sandwiched between two release films.

3. The laminated structure of the high-frequency plate-controlled deep-mixing plate of the present invention.

With the rapid development of 5G communication technology, higher frequency requirements for communication equipment are required. There are a variety of microwave High Frequency Hybrid PCBs on the market. The manufacturing technology of these microwave high-frequency hybrid PCBs also puts forward higher requirements.